WAFER-POSITIONING MECHANISM
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United States of America Patent
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Issued Date -
Jan 7, 2010
app pub date -
Jul 2, 2008
filing date -
Jul 2, 2008
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A wafer-positioning mechanism includes a susceptor having an upper surface for supporting a wafer thereon, which is slanted with respect to a horizontal plane at an angle such that the wafer on the upper surface slides with an aid and does not slide without the aid. The aid is a gas flowing out of the upper surface against the reverse side of the wafer facing the upper surface. The upper surface has a protrusion for stopping the wafer from sliding beyond the protrusion in the sliding direction by contacting an edge of the wafer where the wafer is positioned on the upper surface for wafer processing.
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