INTEGRATED CIRCUIT SYSTEM EMPLOYING A MODIFIED ISOLATION STRUCTURE
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United States of America Patent
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Issued Date -
Dec 31, 2009
app pub date -
Jun 30, 2008
filing date -
Jun 30, 2008
priority date (Note) -
Abandoned
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Abstract
An integrated circuit system that includes: providing a substrate; forming a trench within the substrate; forming a liner on a sidewall of the trench; and forming a dielectric material at a trench bottom with a dielectric width dimension that exceeds that of a width dimension of the trench.
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