APPARATUS FOR REMOVING HEAT FROM PC CIRCUIT BOARD DEVICES SUCH AS GRAPHICS CARDS AND THE LIKE

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20090323286A1
SERIAL NO

12485031

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Apparatus for removing thermal energy from PC circuit board devices such as graphics cards and the like, and including a waterblock adapted to be positioned on one side of a graphics cards, or the like, a heat sink adapted to be secured to the opposite side of the card, and a bridge plate adapted to extend over an edge of the card and be sandwiched between the heat sink and waterblock to serve as a means for coupling heat from the heat sink to the waterblock where it can be transferred to a liquid coolant and transported to an external radiator for disposal. The heat sink may include radiating vanes and an associated heat pipe for enhancing transport of thermal energy collected by the heat sink to the bridge plate.

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Patent Owner(s)

Patent OwnerAddress
EVGA CORPORATION2900 SATURN STREET #B BREA CA 92821

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
HAN, Tai-Sheng (Andrew) Fullerton, US 13 363

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