Chemical Mechanical Polishing Pads Comprising Liquid Organic Material Encapsulated in Polymer Shell and Methods For Producing The Same
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United States of America Patent
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Issued Date -
Dec 31, 2009
app pub date -
Jul 20, 2007
filing date -
Jul 24, 2006
priority date (Note) -
Abandoned
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Abstract
There is provided a chemical mechanical polishing (CMP) pad including a core of a polymer shell encapsulating a liquid organic material having one of a boiling point and a decomposition point of 130° C. or more in a polymer matrix, the CMP pad having open pores formed by the core on a polishing surface thereof, and a method of producing the CMP pad. The CMP pad having a high hardness and a high density improves polishing efficiency and flatness of a wafer and maintains a uniform size of the core, thereby producing pads having high polishing efficiency and stable polishing performance.
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