Polishing pad and the method of forming micro-structure thereof
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United States of America Patent
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Issued Date -
Dec 24, 2009
app pub date -
Oct 30, 2008
filing date -
Jun 19, 2008
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Abandoned
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Abstract
This invention is related to a polishing pad, and more particularly a polishing pad with flexible micro-structure. The polishing pad comprises a connecting surface and a polishing surface. The connecting surface is used to secure on a polishing device. The polishing surface with flexible micro-structure is used to grind and adequately press close to the surface of semiconductor piece. The present invention not only increases the area of polishing surface that contact with the semiconductor piece but also get over the difficulty in pressing close to different piece. It will save grinding time and have a better effect.
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