Multicomponent Copper Alloy and Its Use
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United States of America Patent
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Issued Date -
Dec 24, 2009
app pub date -
Apr 26, 2007
filing date -
Apr 28, 2006
priority date (Note) -
Abandoned
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Abstract
The invention relates to a multicomponent copper alloy comprising [in % by weight]: Ni from 1.0 to 15.0%, Sn from 2.0 to 12.0%, Mn from 0.1 to 5.0%, Si from 0.1 to 3.0%, balance Cu and unavoidable impurities, if desired up to 0.5% of P, if desired individually or in combination up to 1.5% of Ti, Co, Cr, Al, Fe, Zn, Sb, if desired individually or in combination up to 0.5% of B, Zr, S, if desired up to 5% of Pb, and having Mn—Ni silicide phases which have a mass ratio of the elements [w(Mn)+w(Ni)]/w(Si) in the range from 1.8/1 to 7/1.
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