METHOD AND APPARATUS FOR ASSEMBLY OF CMP POLISHING PADS
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Dec 24, 2009
app pub date -
Jun 18, 2008
filing date -
Jun 18, 2008
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
Polishing pads made up of individual polishing elements that protrude through holes in a guide plate are assembled by cascading a number of such polishing elements through a stack of assembly boxes in each of which are located the guide plates such that the polishing elements pass from an uppermost assembly box in the stack to a lowermost assembly box in the stack and in each respective assembly box of the stack are distributed over a respective guide plate therein. Accordingly, at least some of the polishing elements are captured within holes of the respective guide plates in the respective assembly boxes. The cascading may be initiated by displacement of the stack of assembly boxes about a pivot and the distribution of the polishing elements within the assembly boxes may be initiated by lateral displacement of the assembly boxes in the stack.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully