PACKAGE SUBSTRATE HAVING DOUBLE-SIDED CIRCUITS AND FABRICATION METHOD THEREOF
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United States of America Patent
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N/A
Issued Date -
Dec 17, 2009
app pub date -
Jun 2, 2009
filing date -
Jun 3, 2008
priority date (Note) -
Abandoned
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Abstract
A package substrate having double-sided circuits and a method of manufacturing the same are proposed. The package substrate includes a core board having a plated through hole, a plurality of first electrical contact pads, and a first solder mask layer formed on the core board. A first wiring layer and a second wiring layer are disposed on two opposite surfaces of the core board, respectively, and electrically connected to the plated through hole. A portion of the first wiring layer is exposed from a first opening formed in the first solder mask layer. The first electrical contact pads are disposed on the exposed portion of the first wiring layer. The top surface of the first electrical contact pads is higher than that of the first wiring layer to thereby allow a semiconductor chip to be mounted on the electrical contact pads for improving electrical connection.
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