FABRICATION OF INORGANIC MATERIALS USING TEMPLATES WITH LABILE LINKAGE
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United States of America Patent
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Issued Date -
Dec 10, 2009
app pub date -
Mar 8, 2007
filing date -
Mar 9, 2006
priority date (Note) -
Abandoned
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Abstract
A method of forming an integrated circuit layer material is described, comprising depositing a layer of templates on a substrate, said template including a first binding site having an affinity for the substrate, a second binding site having an affinity for a target integrated circuit material and a protecting material coupled to the second binding site via a labile linkage to prevent the binding site from binding to the target integrated circuit material; exposing the template to an external stimulus to degrade the labile linkage; removing the protecting material; and binding the integrated circuit material to the second binding site.
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