METHOD OF FORMING CIRCUITS ON CIRCUIT BOARD
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United States of America Patent
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Issued Date -
Dec 10, 2009
app pub date -
Oct 30, 2008
filing date -
Jun 4, 2008
priority date (Note) -
Abandoned
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Abstract
A method of forming a circuit on a circuit board includes the following steps. Firstly, a surface of an insulating substrate is hydrophilically treated. Secondly, a first circuit layer having a number of electrical traces is formed on the hydrophilically treated surface, the first circuit layer is comprised of a soluble palladium salt. Thirdly, the soluble palladium salt of the first circuit layer is reduced into metallic palladium, thereby obtaining a second circuit layer comprised of metallic palladium. Lastly, an electrically conductive layer is formed on the second circuit layer.
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