HEAT DISSIPATING STRUCTURE OF BACKLIGHT MODULE

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20090303747A1
SERIAL NO

12232506

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A heat dissipating structure of a backlight module includes two light emitting portions and a backlight portion having a light guide plate, a back reflector and a metal clad. The light guide plate is connected to the back reflector. A dent is formed and attached to the light guide plate. The back reflector is connected to the metal clad. Each light emitting portion includes a metal cover, a lamp cup reflector, at least one lamp tube and lamp holders. The lamp cup reflector is attached to the metal cover. A containing groove is formed at the lamp cup reflector and contains the lamp tubes and lamp holders. A thermal conducting plate is extended from the metal cover and contacted with the metal clad. Thus, the heat produced by the lamp tube can be conducted to the metal clad through the lamp holder and the metal cover for heat dissipation.

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First Claim

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Patent Owner(s)

Patent OwnerAddress
KOCAM INTERNATIONAL CO LTD8F NO 82-8 SEC 1 KUANG-FU RD SANCHUNG CITY TAIPEI HSENG

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Tsan-Jung Sanchong City , TW 20 101

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