SEMICONDUCTOR STRUCTURES HAVING VIAS
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Dec 10, 2009
app pub date -
Jun 6, 2008
filing date -
Jun 6, 2008
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A semiconductor structure comprises a substrate having a front surface and a back surface and a via extending from the first surface, the via comprising. The via comprises: a first side; a second side parallel to the first side; a first end extending between the first side and the second side; a second end opposite to the first end and extending between the first side and the second side. The first and second ends form oblique angles with the first and second sides. A method of fabricating the vias is also described.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully