SEMICONDUCTOR WAFER

United States of America Patent

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N/A
Issued Date
Dec 3, 2009
app pub date
May 26, 2009
filing date
May 28, 2008

priority date (Note)
Abandoned

status (Latency Note)

Importance

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Abstract

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A semiconductor wafer has a diameter of 450 mm and a thickness of at least 725 μm and no greater than 900 μm.

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Patent Owner(s)

Patent Owner	Address
SUMCO CORPORATION	MINATO-KU TOKYO
SUMCO TECHXIV CORPORATION	OMURA-SHI NAGASAKI 856-8555

International Classification(s)

B32B:LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA....

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[Patents Count]

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
HASHII, Tomohiro	Tokyo , JP	41	170
KOYATA, Sakae	Tokyo , JP	27	136
OHMACHI, Tomoko	Nagasaki , JP	2	3
SAKAMOTO, Shinji	Nagasaki , JP	31	248
YAMADA, Yasunori	Tokyo , JP	35	339
YUKIWAKI, Satoshi	Tokyo , JP	1	1

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SEMICONDUCTOR WAFER

Number of patents in Portfolio can not be more than 2000

United States of America Patent

12471855

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SERIAL NO	12471855
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12471855

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Abstract

First Claim

Family

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