APPARATUS AND METHOD FOR TRANSFERRING A PLURALITY OF CHIPS FROM A WAFER TO A SUB STRATE
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United States of America Patent
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Issued Date -
Dec 3, 2009
app pub date -
Dec 13, 2006
filing date -
Jan 17, 2006
priority date (Note) -
Abandoned
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Abstract
An apparatus and a method for transferring a plurality of chips from a wafer onto a substrate, in particular a web, wherein at least one first disc or at least on first roll is disposed for successively picking up the chips on the outer perimeter thereof by means of a rotational movement of the first disc or the first roll.
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