Packaging substrate structure
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United States of America Patent
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Issued Date -
Dec 3, 2009
app pub date -
May 28, 2008
filing date -
May 28, 2008
priority date (Note) -
Abandoned
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Abstract
A packaging substrate structure is disclosed, which comprises a dielectric material with Young's Modulus less than 1 Gpa and moisture absorption ratio less than 1.0% in a solder mask, an outer dielectric layer or the combination. The package substrate structure improves the stability and the integration of the product.
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