CARBON NANOTUBES AS INTERCONNECTS IN INTEGRATED CIRCUITS AND METHOD OF FABRICATION
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United States of America Patent
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Issued Date -
Dec 3, 2009
app pub date -
May 27, 2008
filing date -
May 27, 2008
priority date (Note) -
Abandoned
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Abstract
A method of making an electrode, such as an interconnect for a semiconductor device, includes forming aligned carbon nanotubes using dielectrophoresis.
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