PROCESS FOR CONTROLLING SURFACE WETTABILITY
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United States of America Patent
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Issued Date -
Dec 3, 2009
app pub date -
Feb 2, 2006
filing date -
Feb 2, 2006
priority date (Note) -
Abandoned
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Abstract
A process for controlling the wettability of a silicon-containing substrate including forming a polymer coating over at least one surface region of the silicon substrate, the wettability of which is to be controlled; inducing a controlled roughness on the at least one surface region by over-etching the polymer coating using a fluorinated plasma; subjecting the at least one surface region to a surface energy modifying treatment.
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