METHOD OF RESIN ENCAPSULATION MOLDING FOR ELECTRONIC PART
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United States of America Patent
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Issued Date -
Nov 26, 2009
app pub date -
Apr 13, 2007
filing date -
May 17, 2006
priority date (Note) -
Abandoned
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Abstract
A resin encapsulation molding apparatus comprises die assembly of triple die structure and mold release film for covering two cavities respectively corresponding to two substrates. Each of the two cavities comprises inferior die cavity face, cavity side face and cavity face consisting of communication channel face. The mold release film in the state of being tensioned covers each of the two cavities along the morphology thereof. In this condition, molten resin is injected into the two cavities. The molten resin is evenly distributed into the two cavities through communication channel communicating the two cavities with each other. Thereafter, the multiple electronic parts on the two substrates are almost simultaneously immersed in the molten resin within the two cavities and are compression molded.
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