LIGHT-PROOF CHIP PACKAGING STRUCTURE AND METHOD FOR ITS MANUFACTURE
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United States of America Patent
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Issued Date -
Nov 26, 2009
app pub date -
May 22, 2008
filing date -
May 22, 2008
priority date (Note) -
Abandoned
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Abstract
The present invention discloses a light-proof chip packaging structure, which comprises an electronic substrate, at least one semiconductor chip installed on the electronic substrate, and a light-proof film. The light-proof film comprises a main portion, which is substantially conformable to cover all the non-concealed faces of the semiconductor chip. The light-proof film also has an extension portion, which extends from the main portion and covers the areas neighboring the semiconductor chip. The light-proof film comprises a metallic layer capable of blocking light and an insulating layer interposing between the metallic layer and the semiconductor chip. The present invention can effectively reduce the gaps between the semiconductor chip and the light-proof film, whereby no bubble is formed in encapsulating the electronic substrate, thus reducing the possibility of damaging the packing structure.
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