Lead Frame
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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N/A
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app pub date -
Aug 5, 2009
filing date -
Dec 28, 2006
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A lead frame comprises a die pad and leads arranged around the die pad. Through holes are provided in the die pad, and the through holes are located in the peripheries, i.e., margin area of the die pad. The through holes serve to be passed through by the metal wires connected with the leads. By means of the above-described lead frame, the subsequent packaging process of the semiconductor chip; including dual chips and/or multi-chips assembly, is simplified and the effect of the manufacturing process is improved, at the same time, the manufacturing cost is reduced.
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