Chip Mounting Apparatus and Chip Mounting Method
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United States of America Patent
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N/A
Issued Date -
Nov 26, 2009
app pub date -
Nov 30, 2006
filing date -
Dec 6, 2005
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A chip mounting apparatus is provided with a drive control means. The drive control means is provided with a tool holder whereupon a tool for applying pressure to a chip is mounted, a holder supporting means for supporting the tool holder to be vertically moved, a drive means for vertically moving the holder supporting means, and a position detecting means for detecting a relative position of the tool holder to the holder supporting means. The drive control means controls the height and the pressurizing force of the tool, based on the position of the tool holder when the tool and the chip are one over another and brought into contact with a substrate. A chip mounting method is also provided. Short-circuit failures between adjacent solder bumps can be prevented and chips can be mounted with high yield and reliability.
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