SUBSTRATE BONDING APPARATUS

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20090288774A1
SERIAL NO

12469175

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The pressing member facilitates the retainer be bonded to the substrate while preventing the substrate from drawn via adhesive to come off the loading pedestal.

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Patent Owner(s)

Patent OwnerAddress
ORIGIN ELECTRIC COMPANY LIMITED18-1 TAKADA 1-CHOME TOSHIMA-KU TOKYO 171-8555

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Matsumoto, Yutaka Tokyo , JP 90 878
Okamoto, Tetsuya Tokyo , JP 109 588

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