CONDUCTIVE PASTE FOR FORMING OF ELECTRODE OF CRYSTALLINE SILICON SUBSTRATE

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United States of America Patent

APP PUB NO 20090288709A1
SERIAL NO

12448539

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A conductive paste for forming electrodes, which makes it possible to form an electrode for a crystalline silicon substrate that is low in cost and has an equal degree of contact resistance and ohmic electrical contact, as compared to conventional silver electrode pastes, is obtained.It is a conductive paste for forming an electrode for a crystalline silicon substrate, comprising conductive particles, glass frits, an organic binder and a solvent, in which conductive paste is characterized by comprising zinc particles as the conductive particles.

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Patent Owner(s)

Patent OwnerAddress
NAMICS CORPORATIONNIIGATA-SHI NIIGATA 950-3131

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Iida, Hideyo Niigata , JP 21 186
Sakata, Kenichi Niigata , JP 15 190
Yamazaki, Toshiei Niigata , JP 6 53

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