LEAD-FREE SOLDER

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United States of America Patent

SERIAL NO

12497039

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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According to one embodiment of the invention, there is provided a lead-free solder including an alloy rolled into a shape of sheet. The alloy includes: tin; from 10 wt % to less than 25 wt % of silver; and from 3 wt % to 5 wt % of copper. The alloy is free from lead.

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Patent Owner(s)

Patent OwnerAddress
FUJI ELECTRIC CO LTD1-1 TANABESHINDEN KAWASAKI-KU KAWASAKI-SHI 210-9530

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Asagi, Takeshi Tokyo , JP 6 29
Hirai, Masatoshi Tokyo , JP 6 28
Ichinose, Masaki Tokyo , JP 4 6
MAKITA, Kazuyuki Tokyo , JP 5 13
Murata, Toru Tokyo , JP 10 23
Soutome, Masayuki Tokyo , JP 11 122
Watashima, Taketo Tokyo , JP 3 6
Yamashita, Mitsuo Tokyo , JP 85 827

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