SENSING APPARATUS WITH PACKAGING MATERIAL AS SENSING PROTECTION LAYER AND METHOD OF MANUFACTURING THE SAME
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United States of America Patent
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Issued Date -
Nov 19, 2009
app pub date -
May 11, 2009
filing date -
May 19, 2008
priority date (Note) -
Abandoned
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Abstract
A sensing apparatus includes a holding substrate, a sensing chip and a protection layer. The sensing chip is mounted on the holding substrate and electrically connected to the holding substrate. The sensing chip has a sensing region and a non-sensing region other than the sensing region. The sensing region senses image data of an object and thus generates a sensed signal outputted to the holding substrate. The protection layer is formed by a packaging material and is simultaneously processed and integrally formed to cover the sensing region and the non-sensing region of the sensing chip and the holding substrate. The protection layer has an exposed upper surface, which has one portion serving as a sensing surface in contact with the object. The entire protection layer is composed of the same material.
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