Method and Device for the Permanent Connection of Integrated Circuit To a Substrate
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United States of America Patent
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app pub date -
Jun 22, 2006
filing date -
Jun 24, 2005
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Abandoned
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Abstract
The invention relates to a method and an apparatus for permanently joining integrated circuits (1) to at least one substrate (2) arranged therebelow, by means of an adhesive (3) which is arranged therebetween and around the edges of the integrated circuits (1), wherein, in order to cure the adhesive (3), light (19) with a wavelength selected from a wavelength range of 280-900 nm is applied to the upper side and/or underside of the arrangement consisting of the substrate (2) and one of the integrated circuits (1), in order to polymerize the adhesive (3).
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