Solar Cells and Methods for Manufacturing Same
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United States of America Patent
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Issued Date -
Nov 19, 2009
app pub date -
Apr 12, 2007
filing date -
Apr 12, 2006
priority date (Note) -
Abandoned
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Abstract
This invention relates to a method for contacting solar wafers containing one or more layers of temperature sensitive passivation layers by first creating local openings in the passivation layer(s) and then fill the openings with an electric conducting material. In this way, it becomes possible to avoid the relatively high temperatures needed in the conventional method for contacting solar wafers containing one or more passivation layer(s), and thus maintain the excellent passivation properties of newly developed temperature sensitive passivation layer(s) during and after the contacting.
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