POLYVINYL ESTER DISPERSIONS WITH LOW FILM FORMATION TEMPERATURE AND HIGH WATER RESISTANCE AND USE THEREOF
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United States of America Patent
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Issued Date -
Nov 12, 2009
app pub date -
Nov 20, 2006
filing date -
Dec 1, 2005
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Abandoned
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Abstract
Polyvinyl ester dispersions with low film formation temperature and high water resistance and use thereofWhat are described are polyvinyl ester dispersions having a minimum film formation temperature of less than or equal to 10° C. These comprise a crosslinkable polyvinyl ester dispersion and an ester of aliphatic monocarboxylic acids and at least trihydric aliphatic alcohols and/or an ester of at least tribasic aliphatic carboxylic acids and monohydric aliphatic alcohols as film formation assistants.These polyvinyl ester dispersions can be used as adhesives with high water resistance.
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