METHOD OF INSPECTING MOUNTING STATES OF ELECTRONIC COMPONENTS
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United States of America Patent
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Issued Date -
Nov 12, 2009
app pub date -
Aug 27, 2007
filing date -
Sep 13, 2006
priority date (Note) -
Abandoned
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Abstract
An image information of a substrate on which a plurality of electronic components are to be mounted is obtained. Next, the image information is binarized by using a predetermined threshold value, so that binary data are acquired. Then, a tentative presence region recognized as corresponding to the electronic component is acquired on the basis of the binary data. Further, a new threshold value is set by changing the predetermined threshold value. Next, new binary data are acquired by using the new threshold value. Thereby, a new tentative presence region is acquired. Then, the new tentative presence region is combined with the just preceding tentative presence region. Then, a new threshold value is set. A series of above described steps are repeated until all detection results of individual chips indicating whether or not each of the plurality of chips is mounted at a predetermined position, are prepared.
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