HEAT DISSIPATING STRUCTURE
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United States of America Patent
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N/A
Issued Date -
Nov 12, 2009
app pub date -
May 12, 2008
filing date -
May 12, 2008
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A heat dissipating structure for a portable electronic device which includes a heat generating electronic member. The heat dissipating structure includes a base, a first heat pipe, a heat conducting sleeve, and a second heat pipe. The base is mounted on the heat generating electronic member. The base includes a through groove defined therein. One end of the first heat pipe is received in the through groove. The heat conducting sleeve includes a through hole defined therein. The through hole is configured for pivotably connecting the other end of the first heat pipe. One end of the coaxially joining with the first heating pipe in the heat conducting sleeve. The base is configured for conducting heat generated by the heat generating electronic member to the first heat pipe. It is advantageous that the heat dissipating structured can be mounted in limited space.
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