DEVICE AND METHOD FOR THE INSPECTION OF DEFECTS ON THE EDGE REGION OF A WAFER
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United States of America Patent
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app pub date -
Jun 30, 2009
filing date -
Mar 19, 2007
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Abandoned
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Abstract
A method, a device and the application for the inspection of defects on the edge region of a wafer (6) is disclosed. At least one illumination device (41) illuminates the edge region (6a) of the wafer (6). At least one optical unit (40) is provided, said optical unit (40) being positionable subject to the position of the defect (88) relative to a top surface (30) of the edge of the wafer (6a) or a bottom surface (31) of the edge of the wafer (6a) or a face (32) of the edge of the wafer (6a) for capturing an image of said defect.
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