CHIP SCALE SURFACE MOUNT PACKAGE FOR SEMICONDUCTOR DEVICE AND PROCESS OF FABRICATING THE SAME
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United States of America Patent
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app pub date -
Jul 20, 2009
filing date -
Sep 13, 1999
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Abandoned
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Abstract
A semiconductor package has contacts on both sides of the dice on a wafer scale. The back side of the wafer is attached to a metal plate. The scribe lines separating the dice expose the metal plate without extending through the metal plate. A metal layer may be formed on the front side of the dice, covering the exposed portions of the metal plate and extending to side edges of the dice. The metal layer may cover connection pads on the front side of the dice. A second set of scribe lines are made coincident with the first set. Therefore, the metal layer remains on the side edges of the dice coupling the front and the back. As a result, the package is rugged and provides a low-resistance electrical connection between the back and front sides of the dice.
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