CATALYST ATTACHMENT-ENHANCING AGENT
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United States of America Patent
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Issued Date -
Nov 12, 2009
app pub date -
Aug 28, 2006
filing date -
Sep 2, 2005
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Disclosed is a technique for direct plating which causes no deposition of a metal on the rack coating. A catalyst attachment-enhancing agent comprising a high molecular compound having primary, secondary and tertiary amino groups as active ingredient; and a method for direct electroplating onto a Pd/Sn colloidal catalyst which has been subjected to a conductivity-imparting treatment, comprising the step of, prior to the attachment of the Pd/Sn colloidal catalyst to a non-conductive material, treating the non-conductive material with a catalyst attachment-enhancing agent which comprises a high molecular compound having primary, secondary and tertiary amino groups as an active ingredient.
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