Importance

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Abstract

Semiconductor dies embodying electronic circuits are enclosed and protected within a package. To electrically access the die, the package includes external electrical leads which in turn connect to internal bond wires. The bond wires electrically connect the package to the die. As die density and circuit complexity increase, bond wire are placed in greater proximity. As a result, signal coupling between adjacent bond wires also increases and this coupling reduces circuit performance and input/output rates. A dissipation bond wire is provided adjacent the signal or supply bond wire acting as an aggressor. The dissipation bond wire has a first end connecting to the package and the second end connecting to the die or the package to form a conductive loop which dissipates unwanted coupling from an aggressor bond wire before the coupling couples into victim bond wire. The dissipation bond wire may be grounded.

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First Claim