OPTO-ELECTRONIC PACKAGE STRUCTURE HAVING SILICON-SUBSTRATE AND METHOD OF FORMING THE SAME
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United States of America Patent
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app pub date -
Jul 9, 2009
filing date -
Jul 24, 2006
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Abandoned
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Abstract
Disclosed herein is a structure of opto-electronic package having a Si-substrate. The Si-substrates are manufactured in batch utilizing the micro-electromechanical processes or the semiconductor processes, so that these Si-substrates are made with great precision and full of varieties. Based on the material characteristic of the Si-substrate, and the configuration of the components, such as the connectors, opto-electronic devices, depressions, solder bumps, etc., the present invention can improve the optical effect, the heat dissipating effect, and the reliability of the opto-electronic package structure, and simplifies the complexity of the opto-electronic package structure.
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