LED Package Structure and Fabrication Method
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United States of America Patent
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Issued Date -
Nov 5, 2009
app pub date -
Sep 22, 2008
filing date -
May 5, 2008
priority date (Note) -
Abandoned
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Abstract
System and method for packaging an LED is presented. A preferred embodiment includes a plurality of thermal vias located through the packaging substrate to effectively transfer heat away from the LED, and are preferably formed along with conductive vias that extend through the packaging substrate. The thermal vias are preferably in the shape of circles or rectangular, and may either be solid or else may encircle and enclose a portion of the packaging substrate.
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