POWER SUPPLY AND HEAT-DISSIPATING METHOD OF THE POWER SUPPLY
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United States of America Patent
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Issued Date -
Nov 5, 2009
app pub date -
May 2, 2008
filing date -
May 2, 2008
priority date (Note) -
Abandoned
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Abstract
A power supply is mounted in a case for a computer and has a shell, a blower assembly and multiple electrical components. The shell has a rear surface, a heat sink chamber, an electrical component chamber, an air inlet and an air outlet. The chambers have front end communicating with each other. The air inlet and the air outlet are formed through the rear surface of the shell. The blower assembly is mounted in the shell and is adjacent to the rear surface of the shell. The electrical components are mounted in the electrical component chamber and generate heat when the computer operates. The heat-dissipating method of the power supply is to extract air from outside the computer case into the shell to dissipate the heat generated by the electrical components. Using air at room temperature from outside the case is much more efficient to cool down the power supply.
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