Composition for removing protective layer in fabrication of MEMS and method for removing same

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United States of America Patent

APP PUB NO 20090270299A1
SERIAL NO

12081912

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Abstract

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There is provided a composition that can effectively remove a protective coating and a primer coating that have a resistance to etching solutions and are rendered unnecessary after wet-etching treatment in MEMS fabrication processes, and a method for removing the protective layer. The composition contains (A) at least one organic solvent selected from the group consisting of amides, lactones, pyrrolidones and ketones, (B) water, and (C) a fluoride, in an amount of 80.00 to 99.90 mass %, 0.05 to 12.00 mass %, and 0.05 to 8.00 mass %, respectively. The composition may further contain (D) phosphoric acid, phosphonic acid or phosphinic acid in an amount over 0 mass part to 5.5 mass parts, or (E) an organic amine in an amount over 0 mass part to 45 mass parts, based on 100 mass parts of the composition.

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Patent Owner(s)

Patent OwnerAddress
NISSAN CHEMICAL INDUSTRIES LTD7-1 KANDA-NISHIKI-CHO 3-CHOME CHIYODA-KU TOKYO 1010054
BREWER SCIENCE INC2401 BREWER DRIVE ROLLA MO 65401

International Classification(s)

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  • 2008 Application Filing Year
  • C11D Class
  • 413 Applications Filed
  • 274 Patents Issued To-Date
  • 66.35 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances2008200920102011201220132014201520162017201820192020202120220255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Aoba, Kazuhiro Toyama-shi , JP 5 18
Uehara, Hiroyuki Toyama-shi , JP 22 339
Xu, Gu Rolla , US 27 489
Zhong, Xing-Fu Rolla , US 21 206

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Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges1121511339127722101 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7081 - 90100 +0102030405060708090100110120130140150160170180190200210220230

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