POSITIVE PHOTOSENSITIVE RESIN COMPOSITION
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United States of America Patent
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Issued Date -
Oct 29, 2009
app pub date -
Sep 1, 2006
filing date -
Sep 5, 2005
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Abandoned
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Abstract
A photosensitive resin composition comprising parts by mass of polycondensate (A) having a structure resulting from dehydration condensation between one or two or more tetracarboxylic acid dianhydride and one or two or more armatic diamines having mutually ortho-positioned amino and phenolic hydroxyl groups and 1 to 100 parts by mass of photosensitive diazonaphthoquinone compound (B), wherein the polycondensate (A) has a weight average molecular weight of 3000 to 70,000.
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