SOLID-STATE IMAGE PICKUP DEVICE
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United States of America Patent
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Issued Date -
Oct 29, 2009
app pub date -
Feb 5, 2009
filing date -
Apr 23, 2008
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A solid-state image pickup device is provided which includes a substrate; a transistor formed on the substrate; a photoelectric conversion element including a first electrode connected to a drain or a source of the transistor, a semiconductor layer stacked on the first electrode, and a second electrode stacked on the semiconductor layer; an insulating layer disposed on the second electrode; and a bias line formed on the insulating layer to be connected to the second electrode, in which the insulating layer contains at least an inorganic insulating film, and the bias line is connected to the second electrode via a contact hole formed in the insulating layer, and a side surface of the semiconductor layer is in contact with the inorganic insulating film.
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