POLISHING PAD AND METHOD OF USE
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United States of America Patent
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Issued Date -
Oct 29, 2009
app pub date -
Apr 28, 2009
filing date -
Apr 29, 2008
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Abstract
Polishing pads of varying compositions for use in chemical mechanical planarization (CMP) and methods of manufacturing and using such pads. Examples of such polishing pads include two phases, one of which may be a high modulus, low wear material that maintains a stable texture when subject to a conditioning process (e.g., polyoxymethylene, Delrin, polyamide-imide (Torlon), polyetheretherketone (PEEK), and/or polysulfone), and the other of which may be a material having a polishing ability (e.g., a polyurethane material).
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