TEST HANDLER, METHOD OF UNLOADING AND MANUFACTURING PACKAGED CHIPS AND METHOD FOR TRANSFERRING TEST TRAYS
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United States of America Patent
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Issued Date -
Oct 22, 2009
app pub date -
Dec 19, 2008
filing date -
Apr 21, 2008
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A test handler, a method for unloading packaged chips, a method for transferring test trays, and a method for manufacturing packaged chips are provided. The test handler may include: a loading unit having a loading picker to perform a loading process on a test tray located at a loading position, a chamber system in which the packaged chips contained in the test tray transferred from the loading unit are connected to a hi-fix board and tested, and an unloading unit having at least one unloading buffer to move along an unloading moving path formed over a test tray located at an unloading position and an unloading picker to perform an unloading process on the test tray located at the unloading position. The test handler may further include a passage site disposed between the loading unit and the unloading unit and connecting the loading unit and the unloading unit to the chamber system, and a transferring unit transferring the test trays.
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