HEAT-ACTIVABLE ADHESIVE TAPE PARTICULARLY FOR BONDING ELECTRONIC COMPONENTS AND CONDUCTOR TRACKS
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United States of America Patent
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Issued Date -
Oct 22, 2009
app pub date -
Sep 24, 2007
filing date -
Oct 6, 2006
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Abandoned
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Abstract
Heat-activable adhesive tape particularly for producing and further processing electronic components and conductor tracks, with an adhesive composed at least of a) a polyamide having terminal amino and/or acid groups, b) an epoxy resin, c) a compound having a long apolar chain with at least 6 carbon atoms and at least one reactive end capable of reacting with the epoxy resins, d) if desired, a plasticizer, the polyamide reacting with the epoxy resin at temperatures of at least 150.degree. C., and the ratio in weight fractions of a) to b) lying between 50:50 to 99:1.
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