Electronic Assembly and Method for Making Electronic Devices
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United States of America Patent
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Issued Date -
Oct 8, 2009
app pub date -
Apr 2, 2008
filing date -
Apr 2, 2008
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Abandoned
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Abstract
An electronic assembly includes: a circuit substrate with a first mounting surface that has a plurality of spaced apart first mounting regions and at least one second mounting region spaced apart from the first mounting regions; a plurality of first electronic components mounted on the first mounting regions, respectively; and at least one dummy of a non-electronic component mounted on the second mounting region and having dimensions simulating those of the first electronic components. A method for making electronic devices is also disclosed.
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