METHOD OF FORMING CIRCUITS ON CIRCUIT BOARD
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United States of America Patent
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Issued Date -
Oct 1, 2009
app pub date -
Sep 23, 2008
filing date -
Mar 28, 2008
priority date (Note) -
Abandoned
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Abstract
A method of forming a circuit on a circuit board includes the steps of: forming a first circuit pattern made of a nano-scale metal oxide material on a surface of an insulating substrate; reducing the nano-scale metal oxide material into a nano-scale deoxidized metal material, thus obtaining a second circuit pattern; and forming an electrically conductive metal layer on the second circuit pattern.
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