Heat-dissipating module

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20090244844A1
SERIAL NO

12213247

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A heat-dissipating module includes a heat sink, a plurality of fixtures, and a plurality of fasteners. The heat sink includes a plurality of fins and a plurality of hollowed portions located at a periphery thereof. Each of the fixtures includes a support portion and two lap joint portions. Each of the two lap joint portions has a fasten hole. Each of the support portions has a support hole. Each of the fixtures corresponds to one of the hollowed portions. The two lap joint portions of each fixture are mounted to a top edge of the fins and close to two sides of the support portion. The fasteners fasten the lap joint portions to the heat sink. In this way, the heat sink and the fixtures are fastened with each other to enhance the structural durability of the heat-dissipating module. In addition, the heat-dissipating module is small-sized, taking less space.

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First Claim

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Patent Owner(s)

Patent OwnerAddress
TAI-SOL ELECTRONICS CO LTD3F NO 302 RUEIGUANG RD NEIHU DISTRICT TAIPEI CITY 114

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ko, Meng-Hung Taipei County , TW 3 10
Liao, Chin-Chun Taipei City , TW 6 14

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