Heat-dissipating module
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United States of America Patent
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Issued Date -
Oct 1, 2009
app pub date -
Jun 17, 2008
filing date -
Apr 1, 2008
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Abandoned
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Abstract
A heat-dissipating module includes a heat-dissipating member and at least one heat pipe. The heat-dissipating member includes a pillared convexity and an annular groove formed on and surrounding the heat-dissipating member. The at least one heat pipe passes through the annular groove, partially surrounding the convexity and stopped against the convexity.
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