Method and apparatus for imprinting microstructure and stamper therefor

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8192637
APP PUB NO 20090243126A1
SERIAL NO

12388573

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Abstract

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A method of imprinting a microstructure comprising: contacting a stamper comprising a pattern layer with the microstructure of the order of from micrometers to nanometers in one face of the pattern layer and a substrate supporting the pattern layer with an imprinting member having a deformable layer to which the microstructure is imprinted, wherein the pattern layer is supported on a round surface having a prescribed radius of curvature of the substrate, the center of the round surface protruding towards the rear face of the pattern layer; causing the deformable layer on the imprinting member; and separating the stamper from the cured deformable layer.

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Patent Owner(s)

Patent OwnerAddress
HITACHI LTDTOKYO TOKYO METROPOLIS

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ando, Takashi Hitachi, JP 736 6423
Miyauchi, Akihiro Hitachi, JP 83 1546
Ogino, Masahiko Hitachi, JP 110 1695
Washiya, Ryuta Hitachi, JP 11 124

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