CONTACT STRUCTURE AND CONNECTING STRUCTURE
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United States of America Patent
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N/A
Issued Date -
Oct 1, 2009
app pub date -
Feb 5, 2009
filing date -
Mar 27, 2008
priority date (Note) -
Abandoned
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Abstract
A contact structure disposed on a substrate is provided. The contact structure includes at least one pad, at least one polymer bump and at least one conductive layer. The pad is disposed on the substrate and the polymer bump is disposed on the substrate. The polymer bump has a curved surface having a plurality of concave-convex structures. The polymer bump is covered by the conductive layer and the conductive layer is electrically connected with the pad.
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