SINGULATION APPARATUS FOR MANUFACTURING ELECTRONIC COMPONENT
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United States of America Patent
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Issued Date -
Oct 1, 2009
app pub date -
Nov 7, 2007
filing date -
Dec 20, 2006
priority date (Note) -
Abandoned
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Abstract
Regarding a singulation apparatus for singulating a resin encapsulated substrate to manufacture an electronic component, the present invention brings about shortening the delivery period, reducing the footprint, and reducing the cost in compliance with a specification requested by a user. A singulation apparatus for an electronic component has: a basic unit including a receiving unit, singulation unit, and delivery unit; a cleaning unit mounted between the singulation unit and the delivery unit; and an examination unit mounted on the cleaning unit. The singulation unit is appropriately selected in accordance with the requested specification by the user, and a cutting mechanism used in the singulation unit has a rotary blade, water jet, laser light, wire saw, band saw, etc. The cleaning unit and examination unit, both mounted on the basic unit, are each appropriately selected and mounted in accordance with the requested specification by the user. The cleaning unit and examination unit are mounted on the basic unit which has the singulation unit in accordance with the requested specification by the user to form the singulation apparatus for an electronic component.
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